The Defense Microelectronics Activity (DMEA) is seeking a Hot Bar Reflow Soldering System. The proposed contract action is anticipated to be issued as a firm-fixed price contract. The Government recommends a specific contract line item number (CLIN) structure, but offerors are invited to propose alternative structures. The contract will be awarded to the responsible offeror whose offer represents the best value to the Government. Key features of the solicitation include: • The contract is for a Hot Bar Reflow Soldering System • The proposed contract action is a firm-fixed price contract • The Government recommends a specific CLIN structure • Offerors are invited to propose alternative CLIN structures • The contract will be awarded based on best value to the Government