PECVD & ICP-RIE Systems for the Nanoscale Fabrication Center

The University of Wisconsin‑Madison is seeking competitive bids to purchase one or more plasma‑enhanced chemical vapor deposition (PECVD) and inductively coupled plasma reactive ion etching (ICP‑RIE) systems for its Nanoscale Fabrication Center. The equipment will support advanced research in semiconductor device fabrication, nanomaterials, and micro‑electronics. Bidders must submit detailed technical specifications, pricing, delivery schedules, installation, and warranty information through the university’s online procurement portal. The bid window opens on 12 Oct 2026 and closes on 23 Oct 2026. Questions are due by 22 Oct 2026. No site visits or pre‑bid meetings are indicated. • Equipment: PECVD and ICP‑RIE systems (high‑vacuum, plasma processing tools). • Scope: Supply, deliver, install, and commission the systems; provide training and a standard warranty. • Funding: Not disclosed; typical market price for each system ranges from $0.5 M to $2 M. • Evaluation: Based on technical compliance, cost, delivery timeline, and vendor support capabilities. • Contract: Likely a firm‑fixed‑price purchase with performance milestones.