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  5. ›STS Deep Reactive Ion Etcher Upgrade

University of Wisconsin-Madison·Wisconsin

STS Deep Reactive Ion Etcher Upgrade

Closes 7/31/2026$150k – $600kInvitation for Bid
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Description

The University of Wisconsin‑Madison’s Nanoscale Fabrication Center seeks a vendor to upgrade its STS Deep Reactive Ion Etcher (DRIE) control system. The scope includes providing new PAC hardware and HMI software, installing and commissioning the upgrade, delivering complete as‑built documentation, training staff, and supplying a 12‑month preventive‑maintenance service. The contract is a competitive Request for Bid (RFB) with a net‑30 payment term and requires the bidder to hold appropriate insurance, warranty, and de‑barment certifications. • Upgrade of PAC control hardware and HMI for an existing STS DRIE tool • Installation, on‑site commissioning, and training of university personnel • Delivery of full mechanical/electrical drawings, backup software, and 12‑month PM service • Mandatory JAGGAER supplier profile, warranty, and insurance compliance

Attached files

The solicitation documents live at the source — open the bid source above to download them.

Contact

Eric Thompson(Purchasing Services Department)

[email protected]

Key dates

Opened
7/23/2026
Closes
7/31/2026
Duration
12 months

Last updated

Details

Type
Invitation for Bid
Industry
Engineering Services
NAICS
541330
Solicitation №
2027-UWMSN-01411-RFB

Budget estimate

$150,000 – $600,000

The bid likely falls in the mid‑hundreds of thousands of dollars because it covers a specialized equipment control upgrade, on‑site installation, training, documentation, and a full year of preventive‑maintenance service. Based on comparable semiconductor‑tool upgrades, a reasonable range is roughly $150,000 to $600,000, depending on hardware costs and travel expenses.

AI estimate from the solicitation

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